Electronic industry

Electronic Industry

Current regulatuions in the electronic components production (RoHS Restriction of Hazardous Soubstances), has imposed the use of lead-free alloys in alternative to the tin/lead compound; in fact they require a higher melting point compared to the traditional alloys and this can jeopardize the welding process.

Advantages:
Thanks to this technological evolution, the use of inert atmospheres will be applied to both electronic components assembling techniques on PCB (Printed Circuit Board):

SMT TECHNOLOGY- Surface assembling

• Surface Mount Technology “REFUSION PROCESS”
• Decrease od oxidation
• Improvement of the wettability of solder
• Reduction of “solder balls” and solvent residues
• Higher productivity

TECHNOLOGY THT - Traditional Technology

• (Through Hole Tecnology), “WAVE WELDING TECHNOLOGY”
• Improvement of productivity
• Improved solder wettability
• Decrease of solid content
• Stable process
• Higher productivity